EV Sales

Posts Tagged ‘Vehicle’

The Thinks City electric vehicle in Ann Arbor on 3.12.09.
Video Rating: 4 / 5

www.endless-sphere.com

MPGomatic.com gets the lowdown on the Nissan Leaf plug-in electric car at the 2010 Washington Auto Show from Nissan’s Director of Product Planning and Advanced Technology Strategy, Mark Perry. The Leaf will be the first affordable mass market highway-capable pure electric vehicle (based on Lithium battery technology) from a major manufacturer.

Department of Energy Announces 8 Million for Small Business Technology Commercialization

Washington, DC – U.S Energy Secretary Steven Chu today announced that the Department of Energy will award a total of 8 million to small businesses in 34 states to develop technologies with a strong potential for commercialization and job creation.
Read more on U.S. Department of Energy

Wireless Charging for Electric Vehicles: Coming Soon

Similar in principle to induction-charging devices for phones (for example, the “Touchstone” accessory for the Palm Pre), Evatran is developing a solution to charge your electric car without the need to plug it in. The Evatran “Plugless Power” system works by fitting an adapter to the car, and mounting an induction-charging plate in the garage.
Read more on Network World

Cps the World Leader in Alsic Products Now Offers Pin Fin Coolers for Hybrid Electric Vehicle Igbt Power Modules

High reliability, CTE compatibility, and light weight, along with strength, and stiffness are key factors in the design of coolers for power modules in Hybrid Electric Vehicles (HEV) applications. CPS AlSiC coolers meet this challenge with optimum thermal performance and consistent reliability throughout the application life cycle.

Liquid cooling is the most effective way to dissipate heat (1 – 2KW) in HEV power module applications. CPS AlSiC coolers cost effectively offer the pin fin geometries that are required for effective liquid cooling. In addition, CPS AlSiC coolers provide an isotropic thermal expansion that is compatible with device/electronic substrate to reduce mechanically induced stresses during power thermal cycling for improved electronics and module reliability. The AlSiC device compatible thermal expansion (8 ppm/°C) simplifies IGBT assembly compared to Cu pin fin coolers (17 ppm/°C) thermal expansion, eliminating the need for stress compensation layers that increase thermal resistance, assembly complexity and module cost.

AlSiC is a lightweight material (1/3 that of Cu), which makes it an ideal cooler material for the weight-sensitive hybrid electric (HEV), electric vehicle (EV) application and in kinetic energy recovery systems (KERS). AlSiC also has higher strength and stiffness than Cu, which, combined with its lightweight nature, makes AlSiC coolers more tolerant of shock and vibration.

The CPS AlSiC fabrication process efficiently produces both the composite material and fabricates the product geometry in one process step. CPS can work with customers to provide designs that are fabricated to shape requiring no finished machining for very cost effective cooler production.

About CPS Technologies Corporation

CPS Technologies Corporation is the worldwide leader in the design and high-volume production of metal matrix composites. CPS uses a net-shape fabrication process, including patented QuickSet™ injection molding and QuickCast™ infiltration. AlSiC components are used in applications in the wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets. CPS is a publicly traded company (symbol “CPSH”). CPS’ customers include TI, Motorola, HP, Infineon, Agilent and Amkor. For more information on CPS’ AlSiC components, contact Mark Occhionero